Delhi Delhi. Apple is reportedly developing its thinnest iPhone ever, the iPhone 17 Air, for release next year. The phone will include the next-generation A19 chip, which is built using TSMC's advanced 3nm technology.
Reports suggest that Apple may replace the iPhone Plus models with a new iPhone 17 Slim version. According to Jeff Pu, a renowned analyst at Haitong International Tech Research, the iPhone 17 Air will be around 6mm thick. It will be Apple's thinnest phone ever, surpassing the iPhone 6's 6.9mm thickness. Currently, the iPhone 16 Pro and iPhone 16 Pro Max are 8.25mm thick, while the iPhone 16 and iPhone 16 Plus are 7.8mm thick.
The iPhone 17 Air, which is estimated to be just 6mm thick, is set to break Apple's record for the thinnest phone ever. If the rumors prove true, it will surpass the iPhone 6's slim profile.
The iPhone 17 lineup will reportedly feature A19 and A19 Pro chips, built with TSMC's latest N3P technology – an evolution of their third-generation 3nm process. The iPhone 17 and iPhone 17 Air are both expected to use the A19 chip, while the iPhone 17 Pro and iPhone 17 Pro Max will likely use the A19 Pro chip. Currently, the A18 and A18 Pro chips in the iPhone 16 series are manufactured using TSMC's second-generation 3nm process, known as N3E. The A17 Pro chip in the iPhone 15 Pro series is based on the earlier N3B process. The N3P process of the A19 chips promises increased transistor density, which should translate into better performance and power efficiency for the iPhone 17 models compared to their predecessors.
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