PM Modi laid the foundation of HCL-Foxconn OSAT unit –
Tezzbuzz Desk –Prime Minister Narendra Modi on Saturday (February 21) laid the foundation stone of India Chip Limited’s Outsourced Semiconductor Assembly and Test (OSAT) unit in Jewar, Uttar Pradesh. The Prime Minister joined the program through video conferencing. This project is considered important not only for the state but also for the semiconductor mission of the country.
India Chip Private Limited is a 60:40 joint venture between HCL Technologies and Foxconn. This unit, to be built with an investment of about Rs 3700 crore, will have a processing capacity of 20 thousand wafers per month. Display driver chips for smartphones, laptops, automobile systems and industrial electronics will be manufactured here. It is expected to be operational by 2028. This project will create approximately 3500 direct and indirect employment opportunities and will also strengthen the local supply chain.
Many dignitaries including Uttar Pradesh Chief Minister Yogi Adityanath, Union Minister Ashwini Vaishnaw, MP Mahesh Sharma, Minister of State Jitin Prasad and MLA Pankaj Singh were present in the program. HCL Chairperson Roshni Nadar Malhotra and Foxconn Group Chairman Bob Chen were also present on the occasion.
Describing this as the first semiconductor plant of UP, the Union Minister said that the role of chip is very important in the modern economy. Chief Minister Yogi Adityanath said that this project is a big step towards establishing the state as a dream destination for investment and semiconductors will play a decisive role in the economy of the 21st century.
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