Centre Plans Single-Window Portal For Global Chipmakers Under ISM 2.0 Centre Plans Single-Window Portal For Global Chipmakers Under ISM 2.0

Government to develop a dedicated industry portal under ISM 2.0 to address operational bottlenecks faced by global semiconductor players in India

The platform is being designed to handle queries related to customs clearances, state-level approvals, policy interpretation and other procedural hurdles

The second phase of the Mission will also feature expanded categories and refined incentives based on lessons learnt from ISM 1.0.

The government is developing a dedicated industry portal to address operational bottlenecks faced by global semiconductor players in India – a move that signals a sharper focus on execution as the country prepares to roll out the next phase of its semiconductor strategy.

Speaking at the India Electronics and Semiconductors Association’s (IESA’s) ‘Vision Summit’ in Bengaluru, Amitesh Sinha, additional secretary at the Ministry of Electronics and Information Technology (MeitY) and CEO of the India Semiconductor Mission (ISM), said the portal will serve as a single-window interface for companies navigating India’s policy and regulatory landscape.

The platform is being designed to handle queries related to customs clearances, state-level approvals, policy interpretation and other procedural hurdles that foreign suppliers and ecosystem players often encounter. Trade associations from partner countries will also be invited to onboard onto the platform and channel concerns from their member companies through the system.

The move comes as India deepens engagement with multinational semiconductor firms under the ISM and seeks to position itself as a reliable node in global supply chains. “We want to be seen as a trusted partner,” Sinha said, reiterating that intellectual property rights and data confidentiality will be safeguarded.

ISM 2.0 To Deepen Semiconductor Ecosystem

The portal initiative is part of the broader evolution of the semiconductor programme as the government prepares for ISM 2.0. Announced in the Union Budget 2026-27, the second phase of the Mission will feature expanded categories and refined incentives based on lessons learnt from the first phase.

ISM 1.0, launched in 2021 with an approved outlay of ₹76,000 crore (over $10 billion), focused on three key pillars: design, manufacturing and packaging.

According to Sinha, the first phase has already resulted in 10 project approvalswith a few more likely before ISM 1.0 formally closes. These approvals – many involving multinational players – have laid the foundation for India’s entry into advanced semiconductor manufacturing and assembly.

However, as projects move from approval to implementation, operational friction points have become more visible. The planned portal is intended to proactively address these issues and improve the ease of doing business for global suppliers setting up facilities or expanding in India.

Beyond troubleshooting, ISM 2.0 will also broaden the scope of incentives. While design, manufacturing and packaging will remain central, the government plans to extend support to ecosystem elements such as semiconductor equipment, materials and advanced research and development.

In the design segment, Sinha acknowledged feedback from industry stakeholders seeking higher funding support, easier access to debt financing, and stronger market access facilitation for startups. “We are trying to work on all those things and comprehensively we will try to cover their requirements,” he said, adding that incentives across the original three pillars would continue under the new phase.

Workforce development is another priority area under ISM 2.0. Sinha called for structured collaboration between academia, industry, and government to create curricula tailored not only to semiconductor fabrication and packaging but also to adjacent domains such as equipment manufacturing, civil engineering, electrical systems, automation, and robotics.

The emphasis on ecosystem readiness reflects the government’s recognition that semiconductor manufacturing extends well beyond fabs. A robust support network of materials suppliers, equipment vendors, trained operators and engineers is essential for long-term competitiveness.

At the same time, Sinha tempered expectations around full localisation. India, he noted, does not aim to replicate 100% of the global semiconductor supply chain within its borders. Instead, the goal is to build a substantial and competitive share that integrates seamlessly into global networks.

IESA Launches New Division

At the event, semiconductor industry body IESA announced the launch of Indian Design, Semiconductors, Packaging and Systems (IDSPS). It is a dedicated division under IESA focused on India’s semiconductor research and development landscape.

Rao Tummala, Emeritus Professor at the Georgia Institute of Technology, will lead IDSPS, which will also have active participation from industry and related institutions.

A series of new partnerships underscoring push to build deeper semiconductor back-end capabilities were also announced at the Summit. Suchi Semicon and HCLTech announced a strategic collaboration to deliver an integrated, end-to-end solution that combines packaging with advanced test engineering and reliability services within India.

RRP Electronics has also joined hands with HCLTech to offer a comprehensive backend solution. In another move, Kaynes Semicon partnered with Terminus Circuits to drive post-silicon innovation by integrating IP design strengths with ATMP and manufacturing capabilities.