UP will become India’s semiconductor hub: OSAT unit will get speed, HCL-Foxconn’s mega project worth Rs 3706 crore will be on ground.

Lucknow, Read: The country’s semiconductor mission is going to get new momentum in the state. A joint OSAT unit of HCL and Foxconn is going to be set up. The biggest feature of this project is its processing capacity of 20,000 silicon wafers per month, which will prove to be a big step towards India’s self-reliance along with giving the state a strong position in the semiconductor value chain.

According to officials, work on the project will start rapidly after the ground breaking ceremony in mid-January. This unit will be established near Jewar Airport in Yamuna Expressway Industrial Development Authority area. This unit, to be built with an investment of about Rs 3706 crore, will be the first semiconductor assembly and testing facility in the state. Silicon wafers are considered the cornerstone of chip manufacturing in the semiconductor industry. Depending on the technology and size, hundreds to thousands of microchips are produced from one wafer. In such a situation, the processing capacity of 20,000 wafers per month means that this unit will be capable of carrying out the processes related to the manufacturing of lakhs to crores of chips. According to experts, this capacity will prove to be decisive in meeting the growing domestic demand for display driver chips in India. Experts believe that this project will be beneficial for Uttar Pradesh. Establishing India as a semiconductor hub will take India a step forward on the global chip manufacturing map.

There will be direct benefits from mobile to auto sector

This plant will mainly manufacture display driver chips, which are used in mobile phones, laptops, personal computers, automobiles and other electronic devices. Currently India is largely dependent on imports for these chips. Regular processing of 20 thousand wafers will strengthen the domestic supply chain and is likely to significantly reduce import dependence.